Intrinsic and atomic layer etching enhanced area-selective atomic layer deposition of molybdenum disulfide thin films

For continual scaling in microelectronics, new processes for precise high volume fabrication are required. Area-selective atomic layer deposition (ASALD) can provide an avenue for self-aligned material patterning and offers an approach to correct edge placement errors commonly found in top-down patterning processes. Two-dimensional transition metal dichalcogenides also offer great potential in scaled microelectronic devices due to their high mobilities and few-atom thickness. In this work, we report ASALD of MoS2 thin films by deposition with MoF6 and H2S precursor reactants. The inherent selectivity of the MoS2 atomic layer deposition (ALD) process is demonstrated by growth on common dielectric materials in contrast to thermal oxide/ nitride substrates. The selective deposition produced few layer MoS2 films on patterned growth regions as measured by Raman spectroscopy and time-of-flight secondary ion mass spectrometry. We additionally demonstrate that the selectivity can be enhanced by implementing atomic layer etching (ALE) steps at regular intervals during MoS2 growth. This area-selective ALD process provides an approach for integrating 2D films into next-generation devices by leveraging the inherent differences in surface chemistries and providing insight into the effectiveness of a supercycle ALD and ALE process.

Automated summary

New processes for precise high volume fabrication are needed for continual scaling in microelectronics. Area-selective atomic layer deposition (ASALD) can provide self-aligned material patterning and can correct edge placement errors in top-down patterning processes. 2D transition metal dichalcogenides also show potential in scaled microelectronic devices due to their high mobilities and few-atom thickness. In this study, ASALD of MoS2 thin films using MoF6 and H2S precursor reactants is reported, with selective deposition observed on common dielectric materials. The selectivity can be enhanced through atomic layer etching (ALE) steps during MoS2 growth, providing insight into the effectiveness of a supercycle ALD and ALE process.