Ceramics/metals joining under the influence of electric field: A review

Joining ceramics with ceramics and/or metals is of immense importance to widen the application horizons of ceramics and metals. Solid-state joining is restrained by the high joining temperature and long joining time, both of which can be reduced by liquid-state joining. However, the operating temperature of different ceramic-based components is low because of the low melting temperature of the filler. In order to rapidly join ceramic-based materials at low temperatures, various joining techniques utilizing the effect of an electric field (E-field) have been developed. These methods are generally classified into four categories, i.e., spark plasma sintering joining, low E-field assisted joining, anodic bonding and flash joining, according to the value of applied E-field and the types of materials to be joined, resulting in different joining mechanisms and joint performances. These methods are reviewed from the viewpoint of material types that can be joined and mechanisms.

Automated summary

Joining ceramics with ceramics and/or metals is crucial for expanding their application areas. Liquid-state joining is a potential solution to overcome the limitations of high temperature and long joining time in solid-state joining. However, the low melting temperature of the filler restricts the operating temperature. To address this challenge, various joining techniques utilizing the effect of an electric field have been developed to rapidly join ceramic-based materials at low temperatures. This review discusses these methods based on the types of materials that can be joined and the underlying mechanisms.