4.7 Article

Direct ink writing of PEDOT:PSS inks for flexible micro-supercapacitors

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ELSEVIER SCIENCE INC
DOI: 10.1016/j.jiec.2023.03.042

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Printed electronics; Flexible electronics; Direct ink writing printing; Conducting polymers; Micro-supercapacitor

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In this study, flexible micro-supercapacitors (MCSs) based on PEDOT:PSS were fabricated using direct ink writing (DIW) printing. Inks with different PEDOT:PSS concentrations were prepared for DIW printing and their rheological properties and printability were investigated. The optimized PEDOT:PSS ink allowed stable printing and the resulting MCS exhibited high energy storage performance and outstanding cycle stability. The flexibility of the PEDOT:PSS electrode enabled the MCS to maintain its performance under bending stress. Furthermore, the practicality of the system was demonstrated by tailoring the overall operating voltage and output capacitance through printing MCSs connected in series and parallel.
Here, we fabricate poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)(PEDOT:P SS)-based flexible micro-supercapacitors (MCSs) using direct ink writing (DIW) printing. To produce inks suitable for DIW printing, inks with various PEDOT:PSS concentrations are prepared, and their rheological properties and printability are systematically investigated. The optimized PEDOT:PSS ink allows stable printing without spreading and nozzle clogging issues, leading to the successful fabrication of well-defined inter -digitated electrode patterns. The resulting PEDOT:PSS-based MSC exhibits high energy storage perfor-mance (2005 lF/cm2 at 10 lA/cm2) and outstanding cycle stability (capacitance retention of 87% after 10,000 cycles). Taking advantage of the flexibility of the PEDOT:PSS electrode, the MSC maintains its per-formance even under bending stress. Moreover, the practicality of the system is demonstrated by tailor-ing the overall operating voltage and output capacitance through printing MSCs connected in series and parallel. (c) 2023 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.

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