Facial fabrication of paper-based flexible electronics with flash foam stamp lithography

Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (mu PADs), this method has a promising potential in fabricating electrodes of mu PADs.