期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 950, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2023.169900
关键词
Al 7075 alloy; Cryogenic temperature Extrusion Machining; Microstructure; Hardness; Thermal stability; Grain growth kinetics
This study investigates the effect of annealing on the microstructure, precipitation evolution, microhardness, thermal stability, and grain growth kinetics of Al 7075 alloy processed by cryogenic temperature extrusion machining (CT-EM). The study finds that annealing at 150 degrees C improves chip sample hardness through precipitation strengthening. The microstructure contains more dislocation-free equiaxed grains with increasing annealing temperature. The CT-EM method produces a thermally stable ultrafine-grained (UFG) Al 7075 alloy up to 350 degrees C.
In this study, an investigation was conducted over the effect of annealing on microstructure and pre-cipitation evolution, microhardness, thermal stability, as well as grain growth kinetics of Al 7075 alloy processed by cryogenic temperature extrusion machining (CT-EM). A severely deformed microstructure with refined grains and high dislocation density was obtained in the initial CT-EM sample. There was an improvement in the hardness of the chip sample due to the precipitation strengthening in the case of sample annealed at 150 degrees C, when the dislocation density decreased. With the increase of the annealing temperature, more dislocation-free equiaxed grains were present in the microstructure. The recrystalliza-tion process started at 150 degrees C and got completed at 300 degrees C. The ultrafine grained (UFG) Al 7075 alloy fabricated by CT-EM was thermally stable up to 350 degrees C, which could be attributed to the pinning effect of precipitates. The differential scanning calorimeter (DSC) results indicated the efficiency of CT-EM treatment in facilitating precipitate kinetics. The activation energy of grain growth in the Al 7075 alloy subjected to CT -EM was higher than that of materials processed by other severe plastic deformation (SPD) processes.(c) 2023 Elsevier B.V. All rights reserved.
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