期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 958, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2023.170531
关键词
Nanotwinned Cu; Preferred orientation; Electroless plating
High-density Cu nanotwins in columnar grains were successfully fabricated using a formaldehyde-based electroless plating solution. Additives induced the crystallization of the nanotwinned structure, and the deposited Cu nanotwins had a high percentage of (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process make this method promising for future applications in the electronics industry.
High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry. (c) 2023 Elsevier B.V. All rights reserved.
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