A miniature atomization-air-cooled heat sink for electronic chips

With the continuous development of information technology and electronic components, the heat dissipation needs of electronic chips are constantly increasing. A miniature atomization-air-cooled heat sink for electronic chips (MAHSEC) is presented. The combination of cooling fan and piezoelectric ultrasonic atomizer improves the utilization of micro droplets, which makes the MAHSEC simple in structure and excellent in heat dissipation performance. The prototype of MAHSEC is designed and fabricated. The atomization characteristics and heat dissipation performance of MAHSEC are measured by experiments. Experimental results indicate that the at-omization amount increases with the increase of voltage, and the optimal driving frequency is 110 kHz. Under the driving voltage of 70Vpp and driving frequency of 110 kHz, MAHSEC reduces the temperature of electronic chips from 143 degrees C to 45.8 degrees C, which demonstrates that MAHSEC has excellent thermal management performance.

Automated summary

With the continuous development of information technology and electronic components, the heat dissipation needs of electronic chips are constantly increasing. In this study, a miniature atomization-air-cooled heat sink for electronic chips (MAHSEC) is proposed, which combines a cooling fan and piezoelectric ultrasonic atomizer to improve the utilization of micro droplets and enhance heat dissipation performance. Experimental results demonstrate that under specific driving voltage and frequency, MAHSEC reduces the temperature of electronic chips significantly, indicating its excellent thermal management performance.