4.7 Article

4D printed TMP origami metamaterials with programmable mechanical properties

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PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijmecsci.2023.108275

关键词

4D printing; Origami; Metamaterials; Shape memory behavior; Programmability

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4D printing is used to develop Tachi-Miura Polyhedron (TMP) origami metamaterials with reconfigurable shapes and programmable mechanical properties. The TMP origami structures can achieve negative Poisson's ratios and switch between monostable and bistable states. By controlling temperature and adjusting structural parameters, shape memory effects can be programmed to achieve desired deformation shapes and mechanical properties. The 4D printed origami metamaterials offer practical solutions in various engineering applications such as self-deployable structures, energy absorption devices, and flexible electronics.
Origami structures have received significant attention in engineering due to their unique design methods and deformation modes along the crease lines. However, the configurations of origami structures are fixed after fabrication, and their mechanical properties are tough to tune and adapt. To overcome this limitation, herein, a 4D printing method is employed to develop Tachi-Miura Polyhedron (TMP) origami metamaterials with reconfigurable shapes and programmable mechanical properties. The elastic modulus, folding/unfolding de-formations, force-displacement curves and Poisson's ratios of TMP origami metamaterials under different structure parameters and temperature are studied through theoretical models, finite element analysis (FEA) and experiments. Results reveal that the TMP origami structures can achieve negative Poisson's ratios, and their deformation modes can switch between monostable and bistable states. Due to shape memory effects, defor-mation shapes and mechanical properties can be programmed by controlling temperature and tuning structural parameters. The 4D Printed origami metamaterials can provide practical solutions in various engineering ap-plications such as self-deployable structures, energy absorption devices and flexible electronics.

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