4.4 Article

Dopant imaging of power semiconductor device cross sections

期刊

MICROELECTRONIC ENGINEERING
卷 160, 期 -, 页码 18-21

出版社

ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2016.02.056

关键词

Dopant imaging; Scanning Probe Microscopy (SPM); Power semiconductor devices; Silicon carbide

资金

  1. Swiss National Science Foundation [162512]
  2. Nano Argovia programme of the Swiss Nanoscience Institute (WBG-NPA)

向作者/读者索取更多资源

Several Scanning Probe Microscopy (SPM) methods allow to image dopant profiles in a range from 10(14) cm(-3) to 10(19) cm(-3) on semiconducting samples. In our work we present Scanning Capacitance Force Microscopy (SCFM) and Kelvin Probe Force Microscopy (KPFM) experiments performed on cross sections of silicon (Si) and silicon carbide (SiC) power devices and epitaxially grown calibration layers. The contact potential difference (CPD) shows under illumination a reduced influence on surface defect states. In addition results from numerical simulation of these microscope methods are discussed. (C) 2016 Elsevier B.V. All rights reserved.

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