Preparation of polyamidoamine dendrimer-functionalized chitosan beads for the removal of Ag(I), Cu(II), and Pb(II)

Chitosan bead grafted by third-generation dendrimers (CB-G3) with a diameter of 1.40 mm was synthesized to investigate their performance in recovering Ag(I), Cu(II), and Pb(II) ions in aqueous media. The prepared adsorbents were characterized by XRD, FT-IR, elemental analysis, TGA, and SEM, and the effects of pH, contact time, concentration, and temperature were examined. The results showed that the adsorbents were successfully fabricated. The optimum pH value was 5, and the increased generation number contributed to adsorption capacity improvement, indicating that electrostatic interactions between amine groups and metal ions are the governing mechanism of adsorption by the CB-G3. The kinetics, isotherms, and thermodynamics of Ag(I), Cu(II), and Pb(II) adsorption onto the CB-G3 were investigated. The adsorption processes can be described using pseudo-second-order kinetic and Langmuir models. The maximum monolayer adsorption capacities were 105.62, 88.82, and 97.87 mg center dot g(-1) for Ag(I), Cu(II), and Pb(II) at 30 degrees C within 210 min, respectively. Electrostatic interactions and hydrogen bonds are the main mechanisms between metal ions and N atoms. Therefore, the CB-G3 is a promising candidate for Ag(I), Cu(II), and Pb(II) adsorption owing to its splendid ability in easy separation, good adsorptivity, and reusability for efficiently adsorbing Ag(I), Cu(II), and Pb(II) ions.

Automated summary

In this study, chitosan bead grafted by third-generation dendrimers (CB-G3) with a diameter of 1.40 mm was synthesized and found to have excellent performance in recovering Ag(I), Cu(II), and Pb(II) ions in aqueous media. The optimum pH value was found to be 5, and the increased generation number of dendrimers contributed to an improvement in adsorption capacity. The adsorption processes can be described using pseudo-second-order kinetic and Langmuir models, and electrostatic interactions and hydrogen bonds are the main mechanisms between metal ions and N atoms.