Advanced Process Control System for Trench Shape of Power Devices

In the semiconductor manufacturing, the manufacturing equipment is managed via the quality control (QC) in which the shape of the processed feature is checked whether it meets the specification. If the shape is out of the specification, some recipe parameters are modified so that the shape meets the specification. The calculation method of the recipe parameters depends on the know-how of the individual fab engineers, which cause difficulties in the QC. To overcome this problem, we have developed an automatic calculation method of the optimal recipe parameters with Advanced Process Control (APC) system with the stacking model method in order to solve these problems. In the development process, we have also performed comparison of two gap scoring methods. In the on-site demonstration of this system, we have further optimized the exploration method of the recipe parameters.

Automated summary

In semiconductor manufacturing, manufacturing equipment is managed through quality control, which checks the shape of processed features to ensure they meet specifications. If the shape is not within specifications, recipe parameters are adjusted. The calculation method for these parameters relies on individual engineers' expertise, leading to quality control difficulties. To overcome this problem, an automatic calculation method for optimal recipe parameters was developed using Advanced Process Control (APC) system with the stacking model method. The system also includes a comparison of two gap scoring methods and optimization of recipe parameter exploration methods through on-site demonstrations.