4.3 Article

Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI

期刊

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2023.3282298

关键词

Degradation; Stress; Logic gates; Temperature measurement; Thin film transistors; Materials reliability; Contact resistance; IGZO; BTI; hot carrier degradation; reliability

向作者/读者索取更多资源

This study investigates the impact of gate and drain stress biases combination on the degradation of IGZO based TFTs. It shows that the typical signatures of this mechanism are not visible even at high drain biases, and only a gate bias dependence is present in most of the degradation data. The study also identifies an unexpected gate-length dependence of BTI and explores different extrinsic causes.
We studied the impact of gate and drain stress biases combination on IGZO based TFTs degradation targeting hot carrier regime. We show that typical signatures of this mechanism (e.g., saturation current degradation and SS increase) are not visible even at high drain biases, while a gate bias dependence only (BTI) is present in most of the degradation data. We also identify an unexpected gate-length dependence of BTI, for which different extrinsic causes are investigated.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.3
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据