期刊
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
卷 33, 期 5, 页码 -出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2023.3242923
关键词
Surface roughness; Rough surfaces; Surface treatment; Surface morphology; Sputtering; Substrates; Oxidation; Superconductor electronics; TCAD simulation; process simulation
Technology Computer Aided Design (TCAD) is being developed for superconductor electronics (SCE) with the inclusion of a model for surface roughness and statistical simulations. The AlOx tunnel barriers used in SCE have thicknesses similar to the surface roughness of sputtered niobium. This unique module is necessary for generating process-simulated structures and electrical simulations of the Nb/Al-AlOx/Nb junction stack.
Technology Computer Aided Design (TCAD) is being developed for superconductor electronics (SCE). The AlOx tunnel barriers used in SCE have thicknesses on the order of the surface roughness of sputtered niobium. Surface roughness is not included in a standard CMOS TCAD process simulator and is among the unique modules needed for SCE. An empirical model for surface roughness is developed for TCAD process simulators. This model is merged with the existing sputtering module and coupled with chemical mechanical polishing and aluminum oxidation to generate process-simulated structures of the Nb/Al-AlOx/Nb junction stack. Electrical simulations of these junctions are used to extract room temperature conductance. The inherent statistical variation of the proposed surface roughness model lends itself to large scale parallel simulation of thousands of junctions. Statistical simulations are performed and statistical analysis is given.
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