4.7 Article

Mechanically strong hierarchical nanosystem for fire protection and electromagnetic interference shielding

期刊

COMPOSITES PART B-ENGINEERING
卷 261, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2023.110795

关键词

Mechanical toughness; Fire safety; Electromagnetic interference shielding; PZM@CP; TPU-based nanocomposite

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Researchers have developed a feasible and low-cost method to prepare mechanically robust TPU/PZM@CP/CF nanocomposites, which possess enhanced fire retardancy and EMI shielding performances. The nanocomposites exhibit excellent mechanical toughness and superior EMI shielding effectiveness. Furthermore, the thermal stability and fire resistance of the nanocomposites are significantly improved.
Interest in advanced multifunctional composite materials has generated extensive discussions on materials endowed with high fire-resistance, mechanical strength, and excellent electromagnetic interference (EMI) shielding. We designed a feasible and low-cost method for preparing mechanically robust thermoplastic polyurethane/triazine-rich polyphosphazene functionalized titanium carbide@copper phytate/carbon fiber fabric (TPU/PZM@CP/CF) nanocomposites with enhanced fire retardancy and EMI shielding performances. The as-prepared TPU/PZM@CP-2.0/CF demonstrated excellent mechanical toughness, with a tensile strength of 57.8 MPa. Additionally, this nanocomposite exhibited superior EMI shielding performances, with an EMI shielding effectiveness of 29.7 dB and a normal shielding effectiveness of 24.8 dB/mm, surpassing that of most other TPUbased nanocomposites. Furthermore, the thermal stability and fire resistance of the TPU/PZM@CP nanocomposites were significantly improved. For instance, the peak of heat release rate and the peak of smoke production rate of the TPU/PZM@CP-2.0 respectively decreased by 41.5% and 21.5%, compared to those of neat TPU. In this work, the simple preparation method and outstanding comprehensive performances of the mechanically strong multifunctional TPU/PZM@CP/CF have tremendous potential for applications in defense, smart electronic device and aerospace.

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