Enhancing Thermal Conductivity and Mechanical Strength of TPU Composites Through Modulating o-PDA-BN/rGO Heterointerface Networks

Miniaturization in microelectronic devices has spurred the quest for thermally conductive and electrically insulative materials. The main obstacle in using polymer composites is their poor adhesion and thermal resistance at the interface. The study proposes a novel approach: synthesizing a hybrid material consisting of chemically interconnected hexagonal boron nitride (h-BN) and reduced graphene oxide (rGO). The o-PDA-BN/ rGO hybrid network structure, when used as a filler in polymer composites, exhibits significant improvement in through-plane thermal conductivity (TC) of 4.63 Wm-1K-1 and volume resistivity (1012 & omega;cm) at 57 and 3 wt% of BN and rGO filler contents respectively. Additionally, the composite demonstrates enhanced mechanical properties under tension. The experimental findings highlight the covalent interactions between o-PDA-BN/rGO hybrid fillers and thermoplastic polyurethane (TPU), leading to improved thermal stability, thermal conductivity, and mechanical properties. This research paves the way for the development of high-performance composite materials that efficiently dissipate heat in next-generation electronic devices.

Automated summary

The study proposes a novel approach to improve the thermal conductivity and electrical insulation of polymer composites by synthesizing a hybrid material of chemically interconnected hexagonal boron nitride (h-BN) and reduced graphene oxide (rGO). The experimental results show that this hybrid filler can significantly enhance the thermal conductivity and volume resistivity in polymer composites, as well as improve the mechanical properties.