Digital image correlation of cross-ply laminates in tension to reveal

The use of Digital Image Correlation (DIC) to reveal microstructural damage in cross-ply laminates was investigated. Matrix toughness plays a key role in governing microcracking at the tow level in near-surface plies. Experiments revealed that using a tough epoxy polymer as the matrix of the laminate resulted in increased laminate moduli in the principal directions. DIC provides insights into cross-ply laminate failure; the increase in modulus is attributed to microcrack formation in transverse plies. Early onset of matrix cracking around the tows is revealed by variations in the strain along the gauge length. The use of a tough epoxy polymer delays the load at which this cracking occurs. When an untoughened epoxy polymer is used as the matrix, microcracking can be observed at the beginning of the test, suggesting processing induced damage. The use of toughened polymers as the matrix of composite laminates is recommended to mitigate against this.

Automated summary

The study investigates the use of Digital Image Correlation (DIC) to examine microstructural damage in cross-ply laminates. The toughness of the epoxy polymer matrix significantly influences microcracking behavior in the near-surface plies. Experimental results show that using a tough epoxy polymer as the matrix increases the laminate moduli in the principal directions. DIC analysis provides valuable insights into the failure mechanism of cross-ply laminates, and the increase in modulus is attributed to the formation of microcracks in the transverse plies. Early matrix cracking around the tows can be detected by strain variations, and the use of toughened polymers delays the occurrence of this cracking.