The effect of candle-soot reinforced electroless Ni-P particle interface on tribological performance in copper-based materials produced by flake powder metallurgy method: Transfer of candle-soot from waste to solid-lubricant

The softness and ductility of copper can lead to high levels of wear and friction when it encounters other surfaces, which can be detrimental in certain applications. Therefore, improving the tribological properties of copper, such as by coatings or surface treatments, can help to mitigate these issues and make copper even more versatile and useful in a wider range of applications. Accordingly, in this study, functional particles were produced by electroless coating process by providing an electroless Ni-P/candle-soot (CS) nanoparticle (1%vol.) coating layer around each of the flake copper powders followed by production of final materials by flake powder metallurgy including hot-pressing. The wear surfaces were thoroughly analysed using SEM and EDS techniques which allows for the examination of morphological and microstructural characteristics. Due to the homogeneous distribution of Ni-P/CS additives on the interface, the tensile and wear resistances have shown approximately 250% and 1300% increase, respectively, compared to the additive-free Cu materials. While the Ni-P interface in Cu materials caused a decrease in electrical conductivity, the addition of CS resulted in approximately 14% improvement in electrical conductivity. It was showed that electroless Ni-P coatings provide a hard, wear resistant surface with lubricative CS that protects against wear, making them ideal for use in applications such as aerospace, automotive, and electronic industries.

Automated summary

In this study, functional particles were produced by electroless coating process, which improved the tribological properties of copper. The resulting materials had significantly increased tensile and wear resistances, as well as improved electrical conductivity. These materials are ideal for applications in aerospace, automotive, and electronic industries.