4.7 Article

Large piezoelectricity with enhanced thermal stability in BiScO3-BiInO3-PbTiO3 ternary perovskite ceramics

期刊

CERAMICS INTERNATIONAL
卷 49, 期 24, 页码 40953-40959

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ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2023.10.086

关键词

Piezoelectricity; Thermal stability; Curie temperature; Piezoeceramics

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The simultaneous achievement of large piezoelectricity and excellent thermal stability in a piezoceramic material is highly desired for advanced high-temperature electromechanical coupling devices. In this study, a novel zBiScO3-xBiInO3-yPbTiO3 ternary perovskite piezoceramic material was used to achieve a large high-temperature piezoelectric coefficient with a small fluctuation rate over a wide temperature range. The optimal composition of the perovskite ceramics showed excellent high-temperature piezoelectric properties and stability, making them suitable for harsh elevated temperature electromechanical coupling applications.
Simultaneously achieving large piezoelectricity and excellent thermal stability in a piezoceramic is highly desired for constructing advanced high-temperature electromechanical coupling devices. Here, a large hightemperature piezoelectric coefficient (d33 = 523 pC/N at 200 degrees C) with a small fluctuation rate (eta <= +/- 10 %) over an ultra-broaden temperature range of 48-342 degrees C was achieved in novel zBiScO3-xBiInO3-yPbTiO3 (zBS-xBIyPT) ternary perovskite piezoceramics with a high Curie temperature of 440 degrees C. The morphotropic phase boundary (MPB) of multiphase coexistence can be driven and optimized in this system, which is mainly responsible for the enhanced piezoelectricity, and the optimal MPB composition is located at x/y/z = 0.010/ 0.625/0.365. The excellent temperature stability of the optimal MPB sample should be attributed to the increase in the number of thermally stable irreversible non-180 degrees domains. zBS-xBI-yPT perovskite ceramics with excellent comprehensive high-temperature piezoelectric properties exceed many reported lead-based counterparts, and are more suitable for electromechanical coupling applications at harsh elevated temperatures.

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