Enhancing thermal insulation and mechanical strength of porous ceramic through size-graded MA Hollow Spheres

In this study, a series of porous ceramics were prepared using different ratios of small and large size MA hollow ceramic spheres as pore-forming agents, and their thermal insulation properties were investigated. The results showed that increasing the proportion of small size hollow ceramic spheres could effectively decrease the thermal conductivity and improve the compressive strength of the porous ceramics. The optimal porous ceramic was prepared with a ratio of 10 similar to 50 of small and large size hollow ceramic spheres, which had a thermal conductivity of 0.368 W/(m center dot K) at 800 degrees C and a compressive strength of 22.43 MPa. Microscopic analysis indicated that the enhanced thermal insulation and mechanical properties were due to the improved pore structure and the enhanced bonding strength between the ceramic spheres and the matrix. The findings provide valuable insights for the development of high-performance thermal insulation materials.

Automated summary

In this study, a series of porous ceramics were prepared using different ratios of small and large size hollow ceramic spheres as pore-forming agents. The thermal insulation properties of the porous ceramics were investigated. The results showed that increasing the proportion of small size hollow ceramic spheres effectively decreased the thermal conductivity and improved the compressive strength of the porous ceramics. The optimal porous ceramic had a thermal conductivity of 0.368 W/(m·K) and a compressive strength of 22.43 MPa.