4.7 Article

Efficient optimization of parallel micro-channel heat sinks based on flow resistance network model

期刊

APPLIED THERMAL ENGINEERING
卷 233, 期 -, 页码 -

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PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2023.121169

关键词

Electronics cooling; Micro-channel heat sink; Flow resistance network model; Structural optimization

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In this study, a flow resistance network (FRN) model is developed to optimize the structure of three-dimensional liquid-cooled parallel micro-channel heat sinks (PMCHSs). By determining the optimized channel widths and inlet deflector shape based on a uniform flow rate distribution, the optimized PMCHSs can reduce the maximum temperature (Tmax) by 4.0 K and temperature standard deviation (σT) by 20%. The optimization method using the developed FRN model avoids multiple iterations of system parameters in existing methods, showing its potential for high-efficient thermal management of electronics.
Electronics cooling is a critical issue affecting technological development. Parallel micro-channel heat sink (PMCHS) is widely applied for electronics cooling. However, the existing optimization methods are incapable to perform efficient design of three-dimensional liquid-cooled PMCHSs, impeding the thermal management of high power and volume-shrinking electronics. In this study, a flow resistance network (FRN) model is developed for structural optimization of three-dimensional liquid-cooled PMCHSs. Based on the uniform flow rate distribution, the FRN model is used to determine the optimized parallel channel widths and the optimized inlet deflector shape of the PMCHS. With the optimized parallel channel widths, the maximum temperature (Tmax) of the PMCHS is decreased by 4.0 K and the temperature standard deviation (& sigma;T) is decreased by 20%. With the optimized inlet deflector shape, Tmax and & sigma;T are reduced by 4.8 K and 14% respectively. The optimization method based on the developed FRN model for structural design of PMCHSs avoids multiple iterations of system parameters in existing optimization methods, showing its potential in high efficient thermal management of electronics.

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