Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

The Cu-Cu bonding technology is an indispensable vehicle for achieving heterogeneous integration, providing architects and designers with a new solution to address the limitations of transistor miniaturization. In this study, a next-generation efficient-process passivation bonding technology has been developed and investigated. The area-selective passivation bonding platform enables chips to be bonded at ambient temperatures below 200 & DEG;C, while mitigating potential patterning issues and simplifying the complex conventional passivation process. The surface exploration of the area-selective films and their bonding mechanism have been thoroughly investigated through the use of transmission electron microscope (TEM) analyses. The results demonstrate exceptional film quality and the bonded reliability of the area-selective films. Furthermore, devices bonded using an optimized process exhibit more reliable mechanical strength than those bonded using conventional passivation methods.

Automated summary

The Cu-Cu bonding technology is crucial for heterogeneous integration and overcoming the limitations of transistor miniaturization. This study presents a next-generation passivation bonding technology that allows chips to be bonded at temperatures below 200°C, simplifying the complex process. The investigation of area-selective films and bonding mechanism using transmission electron microscope (TEM) reveals exceptional film quality and bonded reliability.