期刊
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
卷 129, 期 10, 页码 -出版社
SPRINGER HEIDELBERG
DOI: 10.1007/s00339-023-06923-4
关键词
a-plane GaN; Ion implantation; Annealing; Raman scattering; HRXRD
In this study, the effect of hydrogen ion implantation on non-polar a-plane GaN epitaxial layer on a sapphire substrate was investigated. Structural and optical characterizations revealed that ion implantation induced lattice distortion, which was partially reduced after annealing. The annealed a-plane GaN thin layer could be easily transferred to other substrates and potentially used in electronic and optoelectronic devices.
In this paper, we report light ion (H+) implantation-induced effect on a-plane GaN epitaxial layer on the sapphire substrate. Non-polar (NP) a-plane GaN (11-20) epitaxial layer is grown on an r-plane sapphire substrate by the metal-organic chemical vapour deposition (MOCVD) technique. The H+ ion-implanted NP (11-20) GaN epitaxial layer (dose 1 x10(17) cm(-2) and 170 keV energy) is annealed by the rapid thermal annealing (RTA) process. The un-implanted a-GaN, H+ ion-implanted and annealed samples are investigated structurally and optically by High-resolution X-ray diffraction (HRXRD), Atomic force microscopy (AFM), Raman spectroscopy and Emission characterisation techniques. HRXRD analysis infers that implanted GaN sample is hydrostatically strained up to implanted depth. Raman scattering study by green laser excitation found defect-activated Raman scattering (DARS) due to lattice distortion by ion implantation in the implanted sample and annealed out partially after annealing. The Raman peak intensity ratio between the E2 (high) and LO peak of the above band-gap excited laser (similar to 266 nm) was around 3.92 in the un-implanted GaN layer whilst after implantation, the ratio was reduced to similar to 0.97 because implantation induces the defect-activated centre which increased the LO peak intensity. After annealing, the ratio between E2 (high) and LO peak was increased by similar to 2.5. After annealing due to partial recovery and reduction in the implantation-induced defected activated centre, the a-plane GaN thin layer can be transferred to the other substrate easily by exfoliation or ion-cutting process and can be used in electronics and optoelectronic devices.
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