Semi-analytical solution for interfacial debonding of high-speed railway ballastless track under thermal loading using a quasi-dynamic method

Interfacial debonding of multi-layered ballastless track systems has proved to be one of the most common diseases in the high-speed railway during long-term operations. This paper focuses on the theoretical modeling of track temperature field and consequent bond-slip behavior between track layers under thermal loading. By establishing heat conduction differential equations, whose boundary conditions are combined with complicated geographical and meteorological factors, the temperature field of a multi-layered track structure is obtained via the integral transform technique. The reliability of the heat conduction model is well-validated by an on-site experiment in a high-speed railway line. Then, we originally extend an explicit integration algorithm for dynamics analysis to solve nonlinear statics problems with small deformation by proposing a quasi-dynamic method (QDM). Equilibrium equations of a track slab subjected to quasi-dynamic equivalent thermal loads and mixed-mode interfacial cohesive forces are constructed based on the Mindlin plate in-plane and flexural vibration equations. The application of the QDM to solve interface responses is verified by comparing results obtained from finite element (FE) software. Finally, numerical discussions are conducted to reveal the nonlinear distribution characteristics of temperature field, evolution process of the interface damage and failure modes under time-varying thermal loads, which provide a better understanding of the interfacial debonding phenomenon encountered in ballastless track systems.(c) 2023 Elsevier Inc. All rights reserved.

Automated summary

This paper focuses on the theoretical modeling of the track temperature field and the bond-slip behavior between track layers under thermal loading in multi-layered ballastless track systems. The temperature field is obtained through heat conduction differential equations and integral transform technique. The reliability of the model is validated by on-site experiments. Additionally, a quasi-dynamic method (QDM) is proposed to solve the interface responses, and its validity is verified by comparing results with finite element software. Numerical discussions are conducted to reveal the characteristics of the temperature field, interface damage evolution, and failure modes under time-varying thermal loads.