期刊
INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING
卷 5, 期 3, 页码 -出版社
IOP Publishing Ltd
DOI: 10.1088/2631-7990/acd826
关键词
PEEK; fused deposition modeling; hydrophobic treatment; laser activation metallization; integrated manufacturing of 3D electronics; resolution
This paper proposes a hybrid AM method combining FDM and LAM for manufacturing 3D electronics based on PEEK. Conformal copper patterns were deposited on 3D-printed PEEK parts, and a high level of adhesion was achieved. The application of a hydrophobic coating on the FDM-printed PEEK promoted better catalytic selectivity and improved the resolution of electroless plated copper lines.
Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from -55 & DEG;C to 125 & DEG;C for more than 100 cycles. Particularly, the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 & mu;m and 100 & mu;m were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated.
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