期刊
出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2015.10.072
关键词
EBSD; Thermal cycle; Recrystallization; Strengthening; Schmid Factor
类别
资金
- National Natural Science Foundation of China [51374084]
- Power Electronics Science and Education Development Program of Delta Environmental and Educational Foundation [DREK2014009]
The explosion of high density and high temperature electronic devices is intensifying the desire for high temperature Pb-free solders. Alloying high melting point elements with conventional solders is one of the most potential solutions drawing attention. In this paper, the relationship between cracking and microstructure evolution of SnAgCu and Ni, Sb, Bi alloyed SnAgCu solders during thermal cycling was systematically studied and compared by ultrasonic C-scanning, SEM, EDX, EBSD, etc. It turned out that alloying Ni, Sb, Bi with SnAgCu solder offered better crack resistance by strengthening and re crystallization energy consumption before similar to 600 cycles. However, its failure dramatically accelerated after those cycles because of the large amount of grain boundaries caused by severe early re crystallization, the coarsened IMCs, and the decrease of Schmid Factor as SnAgCu were softened, while SnAgCuNiSbBi can be excessively hardened by thermal cycles. (C) 2015 Elsevier B.V. All rights reserved.
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