期刊
MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS
卷 19, 期 1, 页码 51-56出版社
UNIV FED SAO CARLOS, DEPT ENGENHARIA MATERIALS
DOI: 10.1590/1980-5373-MR-2015-0139
关键词
Copper; Passivation; Oxidation; Oxidation kinetics
资金
- Ministry of Science and Technology of Taiwan [NSC100-3113-E-002-001]
In this study, we investigate the oxidation behavior of copper at temperatures below 300 degrees C and its mechanism. A methodology to slow down the oxidation rate is then proposed based on the observed mechanism. The oxides formed after oxidation at low temperatures have fine crystal sizes; the rate constants reach 2x10(-15) m(2)/s and 6 x 10(-14) m(2)/s at 200 degrees C and 300 degrees C, respectively. A passivation treatment at 600 degrees C in nitrogen produces a thin oxide layer composed of relatively large Cu2O crystals. The presence of such a layer slows down the oxidation rate constants by an order of magnitude. This study demonstrates that the oxidation of copper at low temperatures is controlled by the grain boundary diffusion. Increasing the crystal size in the surface oxide reduces the oxidation rate significantly.
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