期刊
MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS
卷 19, 期 4, 页码 882-888出版社
UNIV FED SAO CARLOS, DEPT ENGENHARIA MATERIALS
DOI: 10.1590/1980-5373-MR-2015-0456
关键词
Active Screen; DLC; PECVD; Adhesion
资金
- FAPESP
- CNPq
In this work, an active screen plasma discharge system based technology was incorporated in a PECVD reactor for DLC films growth, making it a new development in DLC films deposition. In this case, the active screen system is used to seek better electrons confinement, which might result in high ions density due to the collisions number increase, leading to a possible increase in ionization. DLC films were grown on steel substrates, using two variations of this system. In order to enhance adhesion between coating and substrate, a silicon interlayer was deposited, using different bias voltages. Morphological and structural characterization was performed by scanning electron microscopy, optical profilometry and Raman scattering spectroscopy. Tribological tests were performed by nanohardness, scratch and wear tests. Results showed that the plasma confinement promoted good films adhesion, which may be related to a high sub-implantation. This might be a consequence of the pressure decrease, as well as, to the ions energy distribution narrowing.
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