期刊
MATERIALS RESEARCH BULLETIN
卷 76, 期 -, 页码 107-112出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.materresbull.2015.11.032
关键词
Semiconductors; Transmission electron microscopy (TEM); Thermoelectrics; Electrical properties; Thermal conductivity
资金
- Chunhui Program from Education Ministry of China [Z2014042]
- Key Scientific Research Fund Project of Xihua University [Z1322332]
- Research Project of Education Department of Sichuan Province [14ZB0133]
- Open Research Fund of Key Laboratory of High-performance Materials and Forming Technology in Xihua University [SZJJ2013-034]
- Natural Science Foundation of China [51372208, 51472207, 51572226]
Half-Heusler (HH) thermoelectric (TE) materials have been attracting extensive research interest over the last two decades, owing to their thermal stability, mechanical strength, and moderate ZT. This material system are potential candidates for medium to high temperature applications, which is close to the temperature range of most industrial waste heat sources. In this mini-review article, we briefly summarize the recent progress and advances in HH thermoelectric materials. Some effectively available approaches, such as HH nanocomposites to reduce thermal conductivity, using larger atomic mass and size differences to enhance phonon scattering to further reduce the thermal conductivity, forming ternary systems following the cost effective approach. In addition, new thermoelectric HH members are also discussed in this article, which points out that many new HH compounds may be possible for TE applications. (C) 2015 Published by Elsevier Ltd.
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