Adhesiveless Transfer Printing of Ultrathin Microscale Semiconductor Materials by Controlling the Bending Radius of an Elastomeric Stamp

High-performance electronic devices integrated onto unconventional substrates provide opportunities for use in diverse applications, such as wearable or implantable forms of electronic devices. However, the interlayer adhesives between the electronic devices and substrates often limit processing temperature or cause electrical or thermal resistance at the interface. This paper introduces a very simple but effective transfer printing method that does not require an interlayer adhesive. Controlling the bending radius of a simple flat stamp enables picking up or printing of microscale semiconductor materials onto rigid, curvilinear, or flexible surfaces without the aid of a liquid adhesive. Theoretical and experimental studies reveal the underlying mechanism of the suggested approach. Adhesiveless printing of thin Si plates onto diverse substrates demonstrates the capability of this method.