4.7 Article

Improvement of Heat Resistance of Fluorosilicone Rubber Employing Vinyl-Functionalized POSS as a Chemical Crosslinking Agent

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POLYMERS
卷 15, 期 5, 页码 -

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MDPI
DOI: 10.3390/polym15051300

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fluorosilicone; polyhedral oligomeric silsesquioxane; chemical crosslinking agent; heat resistance

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This study successfully prepared F-LSR-POSS by using POSS-V as a chemical crosslinking agent. Various testing methods such as FT-IR, H-1-NMR, SEM, and XRD confirmed the uniform dispersion of POSS-V in F-LSR-POSS. The mechanical strength and crosslinking density of F-LSR-POSS were determined using UTM and DMA, respectively, showing a significant improvement in heat resistance compared to conventional F-LSR. The introduction of POSS-V as a chemical crosslinking agent overcame the poor heat resistance of F-LSR.
Fluorosilicone rubber (F-LSR) is a promising material that can be applied in various cutting-edge industries. However, the slightly lower thermal resistance of F-LSR compared with that of conventional PDMS is difficult to overcome by applying nonreactive conventional fillers that readily agglomerate owing to their incompatible structure. Polyhedral oligomeric silsesquioxane with vinyl groups (POSS-V) is a suitable material that may satisfy this requirement. Herein, F-LSR-POSS was prepared using POSS-V as a chemical crosslinking agent chemically bonded with F-LSR through hydrosilylation. All F-LSR-POSSs were successfully prepared and most of the POSS-Vs were uniformly dispersed in the F-LSR-POSSs, as confirmed by Fourier transform infrared spectroscopy (FT-IR), proton nuclear magnetic resonance spectroscopy (H-1-NMR), scanning electron microscopy (SEM), and X-ray diffraction (XRD) measurements. The mechanical strength and crosslinking density of the F-LSR-POSSs were determined using a universal testing machine (UTM) and dynamic mechanical analysis (DMA), respectively. Finally, differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) measurements confirmed that the low-temperature thermal properties were maintained, and the heat resistance was significantly improved compared with conventional F-LSR. Eventually, the poor heat resistance of the F-LSR was overcome with three-dimensional high-density crosslinking by introducing POSS-V as a chemical crosslinking agent, thereby expanding the potential fluorosilicone applications.

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