Monitoring of thermal stress in metal plates by using bonded shear horizontal wave piezoelectric transducers

Thermal stress is one of the major causes of failure of engineering structures and its measurement has attracted more attention in recent years. The ultrasonic wave method is very promising in stress measurement due to its non-destructive nature and easy manipulation. The traditional ultrasonic wave transducers require a coupling medium which would introduce large repeatability errors in travel time measurement and thus in the measured stress. In this work, a methodology based on bonded shear horizontal (SH) guided wave piezoelectric transducers was developed to monitor thermal stress in metal plates. The adhesive bonding between the transducer and the specimen ensures the repeatability in travel time measurements, and the strain gauges are also employed to monitor the wave path length. The dispersive equation of acoustoelastic SH wave propagating in an isotropic medium under the uniaxial stress is derived. Both the uniaxial tension test and thermal modulation test have been performed in aluminum and steel plates. The results show that the acoustoelastic constants of the SH0 wave are identical to that of the shear bulk wave as predicted by the acoustoelastic theory and the thermal stress measured from -60 degrees C to 100 degrees C by the proposed method has a very good repeatability (better than 2 MPa) in both the aluminum and steel plates. Considering the convenience and reliability of the bonded SH0 wave piezoelectric transducer, the proposed method is very promising for monitoring of thermal stress in engineering structures, such as rails, etc.

Automated summary

Thermal stress in engineering structures is a major cause of failure, and the measurement of thermal stress has gained more attention recently. The use of ultrasonic wave method shows promise due to its non-destructive nature and ease of use. This study developed a methodology utilizing bonded shear horizontal (SH) guided wave piezoelectric transducers to monitor thermal stress in metal plates. The results demonstrate that the proposed method has good repeatability and potential for monitoring thermal stress in engineering structures.