Self-Formation of a Ru/ZnO Multifunctional Bilayer for the Next-Generation Interconnect Technology via Area-Selective Atomic Layer Deposition

This study suggests a Ru/ZnO bilayer grown using area-selective atomic layer deposition (AS-ALD) as a multifunctional layer for advanced Cu metallization. As a diffusion barrier and glue layer, ZnO is selectively grown on SiO2, excluding Cu, where Ru, as a liner and seed layer, is grown on both surfaces. Dodecanethiol (DDT) is used as an inhibitor for the AS-ALD of ZnO using diethylzinc and H2O at 120 degrees C. H-2 plasma treatment removes the DDT adsorbed on Cu, forming inhibitor-free surfaces. The ALD-Ru film is then successfully deposited at 220 degrees C using tricarbonyl(trimethylenemethane)ruthenium and O-2. The Cu/bilayer/Si structural and electrical properties are investigated to determine the diffusion barrier performance of the bilayer film. Copper silicide is not formed without the conductivity degradation of the Cu/bilayer/Si structure, even after annealing at 700 degrees C. The effect of ZnO on the Ru/SiO2 structure interfacial adhesion energy is investigated using a double-cantilever-beam test and is found to increase with ZnO between Ru and SiO2. Consequently, the Ru/ZnO bilayer can be a multifunctional layer for advanced Cu interconnects. Additionally, the formation of a bottomless barrier by eliminating ZnO on the via bottom, or Cu, is expected to decrease the via resistance for the ever-shrinking Cu lines.

Automated summary

This study proposes the use of a Ru/ZnO bilayer grown through area-selective atomic layer deposition (AS-ALD) as a multifunctional layer for advanced Cu metallization. The ZnO layer serves as a selective diffusion barrier and glue layer, while the Ru layer acts as a liner and seed layer. The adhesion energy between Ru and SiO2 is found to increase with the presence of ZnO. The Ru/ZnO bilayer demonstrates excellent diffusion barrier performance and helps decrease the via resistance in ever-shrinking Cu lines.