Analyzing the pressure and thermal efficiency of chemically synthesized nanofluids for computer cooling methods

To maintain ideal working conditions by removing heat, a particular technique must be applied. This research examines how nanofluids affect computer cooling microchannel heating devices. The experiment's working fluids are 25% Therminol-55 and 75% sprinkling water. The mixture contains silicon carbide (SiC), titanium oxide (TiO2), and zinc oxide (ZnO) nanoparticles. It includes 0.25% to 1.5% nanoparticles and flows at 0.025 to 0.080 kg/s at 25 degrees C to 40 degrees C. Central processing unit temperature, heat transfer rate, pressure losses, and pumping power have been examined. SiC-THERMINOL/SPRINKLING WATER at 1.5% concentration and 0.080 kg/s had a 9% lower temperature and 31% larger heat transfer coefficient than the base fluid. SiC-TL/SW has the highest pressure decrease and pumping force power compared to TiO2-TL/SW. Because nanofluid beats basic fluid in computer cooling, a little increase in pumping force power and pressure reduction may be tolerated.

Automated summary

This research investigates the effects of nanofluids on computer cooling microchannel heating devices by enhancing heat dissipation through the addition of nanoparticles. The experiment uses a mixture of 25% Therminol-55 and 75% sprinkling water containing silicon carbide (SiC), titanium oxide (TiO2), and zinc oxide (ZnO) nanoparticles. The results show that the SiC-THERMINOL/SPRINKLING WATER mixture with a concentration of 1.5% and a flow rate of 0.080 kg/s has a 9% lower CPU temperature and a 31% higher heat transfer coefficient compared to the base fluid. SiC-TL/SW also exhibits the highest pressure decrease and pumping power compared to TiO2-TL/SW. A slight increase in pumping power and pressure reduction can be tolerated due to the superior cooling performance of nanofluids.