4.6 Article

Deep reactive ion etching of cylindrical nanopores in silicon for photonic crystals

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Review Engineering, Electrical & Electronic

A review on the mainstream through-silicon via etching methods

Haoming Guo et al.

Summary: This review provides a comprehensive summary of four mainstream TSV etching methods, including KOH wet etching, laser drilling, deep reactive ion etching, and photo-assisted electrochemical etching. It covers their etching mechanism, process, parameters, and hole structure, aiming to offer researchers and engineers an updated understanding of these methods.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2022)

Article Physics, Multidisciplinary

Spatially Shaping Waves to Penetrate Deep inside a Forbidden Gap

Ravitej Uppu et al.

Summary: By shaping the wave fronts spatially, waves can be transported much deeper into two-dimensional silicon photonic crystals, with the energy density enhanced at a tunable distance from the front surface, extending up to 8 times the Bragg length. This novel control method for mesoscopic wave transport is applicable to any type of waves.

PHYSICAL REVIEW LETTERS (2021)

Review Chemistry, Analytical

Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication

Michael Huff

Summary: This paper reviews advances in reaction-ion etching (RIE) for high-aspect-ratio microfabrication, highlighting the importance of anisotropic etching for precise control of device dimensions. Newer RIE methods have enabled deeper etches and higher aspect ratios, particularly in the development and production of silicon-based micro- and nano-machined devices.

MICROMACHINES (2021)

Article Optics

Experimental probe of a complete 3D photonic band gap

Manashee Adhikary et al.

OPTICS EXPRESS (2020)

Review Physics, Applied

MEMS at Bosch - Si plasma etch success story, history, applications, and products

Franz Laermer et al.

PLASMA PROCESSES AND POLYMERS (2019)

Article Chemistry, Multidisciplinary

X-ray Imaging of Functional Three-Dimensional Nanostructures on Massive Substrates

Diana A. Grishina et al.

ACS NANO (2019)

Article Materials Science, Multidisciplinary

Reflectivity calculated for a three-dimensional silicon photonic band gap crystal with finite support

D. Devashish et al.

PHYSICAL REVIEW B (2017)

Article Chemistry, Multidisciplinary

Fabrication of porous silicon-based optical sensors using metal-assisted chemical etching

R. F. Balderas-Valadez et al.

RSC ADVANCES (2016)

Article Physics, Applied

A practical approach to reactive ion etching

Fouad Karouta

JOURNAL OF PHYSICS D-APPLIED PHYSICS (2014)

Article Chemistry, Multidisciplinary

Inverse-Woodpile Photonic Band Gap Crystals with a Cubic Diamond-like Structure Made from Single-Crystalline Silicon

J. M. van den Broek et al.

ADVANCED FUNCTIONAL MATERIALS (2012)

Article Physics, Multidisciplinary

Observation of Sub-Bragg Diffraction of Waves in Crystals

Simon R. Huisman et al.

PHYSICAL REVIEW LETTERS (2012)

Article Physics, Condensed Matter

Porous silicon layers prepared by electrochemical etching for application in silicon thin film solar cells

R. S. Dubey et al.

SUPERLATTICES AND MICROSTRUCTURES (2011)

Review Physics, Applied

High aspect ratio silicon etch: A review

Banqiu Wu et al.

JOURNAL OF APPLIED PHYSICS (2010)

Article Nanoscience & Nanotechnology

Periodic arrays of deep nanopores made in silicon with reactive ion etching and deep UV lithography

Leon A. Woldering et al.

NANOTECHNOLOGY (2008)

Review Physics, Applied

From MEMS to nanomachine

M Esashi et al.

JOURNAL OF PHYSICS D-APPLIED PHYSICS (2005)

Article Engineering, Electrical & Electronic

Optical fiber communication: From transmission to networking

R Ramaswami

IEEE COMMUNICATIONS MAGAZINE (2002)

Article Engineering, Electrical & Electronic

Wet and dry etching techniques for the release of sub-micrometre perforated membranes

S Kuiper et al.

JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2000)