Strong cube texture formation of Ni5W/Ni9.3W/Ni5W composite thin substrates for YBCO-coated conductors

The Ni-5 at.%W/Ni-9.3 at.%W/Ni-5 at.%W alloy composite substrate with a thickness of 109 mu m was produced by powder metallurgy and rolling process. The composite substrates with different thicknesses were produced by electrochemically polishing the outer layer of each substrate. When the thickness of the composite substrate was reduced to 72 mu m, the cubic texture could still reach 97.3% by using electron backscatter diffraction. Moreover, its saturation magnetization only reached 2.3 (emu/g). Finally, the cubic texture of composite substrates was found to vary in thickness thinning because the grain growth mechanism between the inner and outer layers is different. The inner layer defect has a pin effect on grain boundary migration, and in the outer layer, the cubic grain grows more easily to the surface and along the rolling direction. However, the formation of cubic-oriented grains is hindered by the twin defects in the inner layer.

Automated summary

The Ni-5 at.%W/Ni-9.3 at.%W/Ni-5 at.%W alloy composite substrate with a thickness of 109 mu m was produced by powder metallurgy and rolling process. The cubic texture of the composite substrates reached 97.3% even when the thickness was reduced to 72 mu m. However, the saturation magnetization was only 2.3 (emu/g). The formation of cubic-oriented grains was hindered by twin defects in the inner layer.