期刊
MACROMOLECULAR RAPID COMMUNICATIONS
卷 44, 期 13, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/marc.202300060
关键词
liquid crystalline; polyimide films; thermal conduction networks; thermal management
This review discusses the design of polyimide films with ordered liquid crystalline structures to enhance thermal conduction and reviews the effects of filler type, thermal conduction paths, and interfacial thermal resistances on thermally conductive behavior. It also provides an outlook on the future development of thermally conductive polyimide films.
Currently, heat accumulation has seriously affected the stabilities and life of electronic devices. Polyimide (PI) film with high thermal conductivity coefficient (lambda) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal conduction models, this review presents design ideas of PI films with microscopically ordered liquid crystalline structures which are of great significance for breaking the limit of lambda enhancement and describes the construction principles of thermal conduction network in high-lambda filler strengthened PI films. Furthermore, the effects of filler type, thermal conduction paths, and interfacial thermal resistances on thermally conductive behavior of PI film are systematically reviewed. Meanwhile, this paper summarizes the reported research and provides an outlook on the future development of thermally conductive PI films. Finally, it is expected that this review will give some guidance to future studies in thermally conductive PI film.
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