This paper presents a conducting material, the textured Ni-encapsulated carbon tube, which can be used in EMI shielding materials by inserting it into the center of a PDMS polymer. By utilizing the textured Ni-encapsulated plant fiber, Pd2+ could catalyze the reduction of Ni2+ as a catalytic center. The Ni coating's excellent heat-conducting capability allows the inner plant fiber to carbonize and attach to the Ni-tube during annealing, resulting in the successful fabrication of a textured Ni-encapsulated C tube.
The exploration of flexible and lightweight electromagnetic interference (EMI) shielding materials with excellent shielding effectiveness, as a means to effectively alleviate electromagnetic pollution, is still a tremendous challenge. This paper proposes a conducting material named the textured Ni-encapsulated carbon tube, which can be applied in EMI shielding material by being inserted in the center of a poly(dimethysiloxane) (PDMS) polymer. We demonstrated that Pd2+ could be absorbed by the active groups on the plant fiber surface to catalyze the reduction of Ni2+ as a catalytic center by means of a textured Ni-encapsulated plant fiber. Owing to the outstanding heat-conducting capability of the Ni coating, the inner plant fiber was carbonized and attached to the Ni-tube inside the surface during annealing. To be precise, the textured Ni-encapsulated C tube was fabricated successfully after annealing at 300 degrees C. On further increasing the annealing temperature, the C tube disappeared gradually with the Ni coating being oxidized to NiO. Of note, the C tube acted as a support layer for the external Ni coating, providing sufficient mechanical strength. When combined with the coating PDMS layer, a flexible and lightweight EMI shielding material is fabricated successfully. It displays an outstanding EMI shielding effectiveness of 31.34 dB and a higher specific shielding efficiency of 27.5 dB center dot cm3/g, especially showing excellent mechanical property and flexibility with only 2 mm thickness. This study provides a new method to fabricate outstanding EMI shielding materials.
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