Plasma-enhanced atomic layer deposition of nickel and nickel oxide on silicon for photoelectrochemical applications

The production of hydrogen fuel through sunlight-driven water splitting has the potential to harness and store large quantities of solar energy in a clean and scalable chemical state, suitable for later use in a range of energy applications. Silicon (Si) possesses many of the required properties to be used effectively as a photoelectrochemical (PEC) water-splitting photoanode. However, its sensitivity to corrosion during the oxygen evolution reaction limits its performance in photoanode applications, thus requiring additional overlayer materials to protect the underlying Si substrate. Nickel oxide (NiO) is one material that acts as an effective protective layer, being transparent, suitably conductive and stable. In this work, we present NiO deposition via state-of-the-art atomic layer deposition and photoemission studies to grow and characterize NiO and Ni-metal protective films. Early-stage nucleation of deposited thin films is illustrated along with the effects of post-deposition annealing and argon milling on depth profile information. Previous reports on the effects of slow argon milling are explored and counter arguments are proposed. Protective films are subjected to PEC testing, which shows enhancement of stability and photocurrent output as a result of the deposited films and plasma annealing on these thin films.

Automated summary

The production of hydrogen fuel through sunlight-driven water splitting has great potential for storing solar energy in a clean and scalable chemical state. Silicon is a suitable material for the photoelectrochemical (PEC) water-splitting photoanode, but it needs additional protective layers to overcome corrosion. Nickel oxide (NiO) is one effective protective material, and this study focuses on the deposition and characterization of NiO and Ni-metal protective films.