4.7 Article

Thermal insulation of 3D printed complex and miniaturized SiO2 aerogels at medium-high temperatures

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JOURNAL OF NON-CRYSTALLINE SOLIDS
卷 608, 期 -, 页码 -

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ELSEVIER
DOI: 10.1016/j.jnoncrysol.2023.122251

关键词

3D printing; SiO2 aerogel; Opacitiers; Thermal insulation; Medium-high temperatures

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In this study, SiO2 aerogels were fabricated using 3D printing technology, and opacifiers were added to reduce thermal conductivity. The printed SiO2 aerogel had a low thermal conductivity of 0.028 W/(m center dot K) at room temperature. The aerogel doped with 10 wt% SiC exhibited the best thermal insulation at medium-high temperatures. The 3D printed aerogel doped with 10 wt% SiC had a compression performance of 1.19 MPa, more than 10 times better than usual aerogels. This paper provides a method for creating micro-objects and complex-shaped objects with excellent medium-high temperature thermal insulation using Direct Ink Writing (DIW).
Due to aerogel ' s network structure, specific surface area, and high porosity, SiO2 aerogel has excellent thermal insulation and inferior mechanical properties. It is challenging to produce micro-objects and complex-shaped objects accurately by traditional manufacturing method because of the fragile mechanical properties. Here, we use 3D printing to fabricate SiO2 aerogels. At the same time, we add opacifiers to reduce the aerogel ' s medium-high temperature thermal conductivity. The thermal conductivity of the SiO2 aerogel printed in the experiment is as low as 0.028 W/(m center dot K) at room temperature. The aerogel doped with 10 wt% SiC has the best thermal insulation at medium-high temperatures. And the 3D printed aerogel doped with 10 wt% SiC has a compression performance of 1.19 MPa, which is more than 10 times better than the usual aerogel. This paper provides a method for creating micro-objects and complex-shaped objects with excellent medium-high tem-perature thermal insulation using Direct Ink Writing (DIW).

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