Review of ultrasonic-assisted soldering in Sn-based solder alloys

Sn-based lead-free solder has been widely applied in areas like electronic packaging due to its excellent solderability. The composite solders can be obtained by mixing additional elements in the Sn alloy, including Sn-Cu, Sn-Zn, Sn-Ag, and Sn-Bi solder. Combined with different technologies, various requirements for connection can be met. The Ultrasonic-assisted collection has the ability to optimize the structure and performance of joints due to its unique cavitation effect, which is mainly used in the field of brazing. Behalf of improving the performance of connectors, ultrasonic technology has been gradually introduced into soldering gradually. Based on the latest research of ultrasonic-assisted soldering in Sn-based solder joints, it is the application of different Sn-based solder that is taken as the starting point in this paper. The processing of ultrasonic-assisted soldering is summarized for the analytical or evaluative account of different research outcomes, and the factors affecting the performance of solder joints caused by ultrasound are analyzed and discussed. Besides, some suggestions are put forward, which may provide a reference for future application and development hopefully.

Automated summary

This paper focuses on the application of Sn-based lead-free solder in electronic packaging and introduces the method of obtaining composite solders by mixing additional elements. The ultrasonic-assisted connection technology can optimize the structure and performance of joints and has been gradually introduced into soldering. The paper summarizes the application of ultrasonic-assisted soldering in Sn-based solder joints and analyzes the impact of ultrasound on the performance of solder joints.