☆ 4.6 Article

Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2023)

相关参考文献

注意：仅列出部分参考文献，下载原文获取全部文献信息。

Article Materials Science, Multidisciplinary

Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon

Bo Lin et al.

Summary: In this study, nanoscale nickel particles anchored in a carbon skeleton (Ni@C) with flake structure were successfully prepared by carbonizing a nickel-based metal organic framework at high temperature. The addition of Ni@C flakes to Sn-0.7Cu solder significantly improved wettability, reduced the size of matrix 13-Sn grains, and transformed the elongated (Cu, Ni)6Sn5 phase. The formation of (Cu, Ni)6Sn5 at the interface and the presence of porous carbons in the solder matrix effectively hindered the diffusion of Cu and Sn, leading to a decrease in the growth rate of intermetallic compounds (IMCs).

MATERIALS CHARACTERIZATION (2022)

添加到收藏夹

Article Chemistry, Physical

Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder

Cong Xiong et al.

Summary: The study investigates the use of Ni-Cu/SAC composite solders with different Cu contents as interlayers for soldering Al alloy joints. The microstructure formation and evolution are found to be influenced by the Cu contents. Different initial phases and phase transitions are observed in Ni18Cu/SAC and Ni38Cu/SAC joints. The shear strength of the joints initially increases and then decreases with soldering time, with the Ni18Cu/SAC joints soldered for 10 minutes exhibiting the highest shear strength.

JOURNAL OF ALLOYS AND COMPOUNDS (2022)

添加到收藏夹

Review Materials Science, Multidisciplinary

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Mu-lan Li et al.

Summary: Researchers utilize nanoparticles to enhance the performance of solder joints, resulting in refined matrix, improved wetting ability, and strengthened mechanical performance of the solder. The size and content of particles influence the structure and properties of the solder, while nanoparticles impact melting temperature, wetting ability, creep behaviors, electromigration properties, etc.

MATERIALS & DESIGN (2021)

添加到收藏夹

Article Acoustics

On the mechanism of dendritic fragmentation by ultrasound induced cavitation

S. Wang et al.

ULTRASONICS SONOCHEMISTRY (2019)

添加到收藏夹

Article Materials Science, Multidisciplinary

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Meng Zhao et al.

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS (2019)

添加到收藏夹

Article Materials Science, Multidisciplinary

Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics

Ying Zhong et al.

ACTA MATERIALIA (2019)

添加到收藏夹

Review Chemistry, Multidisciplinary

The Chemical History of a Bubble

Kenneth S. Suslick et al.

ACCOUNTS OF CHEMICAL RESEARCH (2018)

添加到收藏夹

Article Automation & Control Systems

A Solution to Press-Pack Packaging of SiC MOSFETS

Nan Zhu et al.

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS (2017)

添加到收藏夹

Article Engineering, Industrial

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

M. A. A. Mohd Salleh et al.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2017)

添加到收藏夹

Article Engineering, Electrical & Electronic

Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

Mingna Wang et al.

MICROELECTRONICS RELIABILITY (2017)

添加到收藏夹

Review Engineering, Electrical & Electronic

A review of lead-free solders for electronics applications

Shunfeng Cheng et al.

MICROELECTRONICS RELIABILITY (2017)

添加到收藏夹

Review Nanoscience & Nanotechnology

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Wen-Wei Shen et al.

NANOSCALE RESEARCH LETTERS (2017)

添加到收藏夹

Review Nanoscience & Nanotechnology

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Wen-Wei Shen et al.

NANOSCALE RESEARCH LETTERS (2017)

添加到收藏夹

Article Chemistry, Physical

Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

Guang Chen et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2016)

添加到收藏夹

Article Materials Science, Multidisciplinary

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L. C. Tsao et al.

MATERIALS & DESIGN (2010)

添加到收藏夹

Article Chemistry, Physical

Strengthening mechanism of SiC-particulate reinforced Sn-3.7Ag-0.9Zn lead-free solder

X. Wang et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2009)

添加到收藏夹

Article Computer Science, Hardware & Architecture

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

K. Sakuma et al.

IBM JOURNAL OF RESEARCH AND DEVELOPMENT (2008)

添加到收藏夹

Article Chemistry, Physical

Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder

Jingbo Wan et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2008)

添加到收藏夹

Article Engineering, Electrical & Electronic

Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy

Ping Liu et al.

JOURNAL OF ELECTRONIC MATERIALS (2008)

添加到收藏夹

Article Materials Science, Multidisciplinary

Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate

A Hirose et al.

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS (2004)

添加到收藏夹

© Peeref 2019-2024. All rights reserved.