4.6 Article

Effects of deformation stress mode on twin activation of CP-Ti wire through cryogenic non-circular drawing sequence

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2023.117924

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Cryogenic deformation; Digital image correlation; Titanium wire-drawing process; Non -circular drawing sequence; Microstructure; Twining

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A cryogenic-temperature-non-circular drawing sequence (CT-NCD) at 123 K was developed to investigate the twin activation effects on CP-Ti for manufacturing high-strength CP-Ti wire. The cryogenic tensile test showed that the CT-NCD improved the tensile strength by 58.5% and strain by 52.1% compared to room temperature results. The CT-NCD produced faultless CP-Ti wires with increased strength and micro-Vickers hardness.
A cryogenic-temperature-non-circular drawing sequence (CT-NCD) at 123 K was designed to investigate the effects of the deformation stress mode on the twin activation of a commercial pure titanium (CP-Ti) for manufacturing a high-strength CP-Ti wire. A cryogenic tensile test was conducted using a digital image correlation camera in a cryogenic chamber. The cryogenic-tensile strength of CP-Ti was improved by 58.5% and strain was improved by 52.1% when compared with the tensile-test results at room temperature. The CT-NCD was conducted in the cryogenic chamber and the results were compared with those of the room-temperature wire drawing (RT-WD). The numerical and experimental results confirmed that the CT-NCD sequence continued to produce faultless CP-Ti wires. The mechanical properties of the CT-NCD wire showed that the strength increased by 12.6% with comparable ductility, and micro-Vickers hardness increased by 17.4% when compared with that of the RT-WD. The twin map obtained through electron-backscattering diffraction showed that the twinning of the CT-NCD wire significantly increased when compared with that of the RT-WD due to temperature and process effects. From the numerical analysis results, the NCD sequence generated more tensile twin than WD owing to the deformation stress mode change by a die shape. It was concluded that the proposed CT-NCD sequence affects twin activation by deformation stress mode from the die design and temperature changes, compared to the conventional RT-WD, resulting in grain refinement and mechanical property enhancement. Based on the results, CT-NCD is considered useful for manufacturing the high-strength CP-Ti wire for industrial applications.

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