4.6 Article

Effects of Neutron Irradiation on Electrical Performance of β-Ga2O3 Schottky Barrier Diodes

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IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2023.3270124

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Defects; electrical performance; Ga2O3; neutron irradiation; Schottky barrier diode (SBD)

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This study investigates the effect of neutron irradiation on the electrical performance of the beta-Ga2O3 Schottky barrier diode (SBD) device. The results show that after neutron irradiation, there is a decrease in forward current density (J(F)), reduction in reverse current density (J(R)), and increase in breakdown voltage (V-br) based on current-voltage (I-V) measurements. The density of interface states slightly increases, and there is an increase in trap activation energy after neutron irradiation according to frequency-dependent conductance technique. The carrier concentration across the Ga2O3 drift layer decreases after neutron irradiation based on capacitance-voltage (C-V) measurements.
The effect of neutron irradiation on the electrical performance of the beta-Ga2O3 Schottky barrier diode (SBD) device has been studied in this work. After equivalent 1 MeV neutron irradiation with a fluence of 1 x 10(14) n/cm(2), a 20% decrease in the forward current density (J(F)), a 75% reduction in the reverse current density (J(R)), and a 300 V increase in the breakdown voltage (V-br) have been observed according to current-voltage (I-V) measurements. Utilizing the frequency-dependent conductance technique, it is found that the density of interface states located at Pt/Ga2O3 increases slightly from 2.6 x 10(12)-6.4 x 10(12) to 2.9 x 10(12)-7.0 x 10(12) cm(-2)eV(-1) with an increase in trap activation energy from 0.09-0.122 to 0.096-0.134 eV after neutron irradiation. Furthermore, based on the capacitance-voltage (C-V) measurement, it is observed that the carrier concentration across the Ga2O3 drift layer was decreased from 1.80 x 10(16) to 1.35 x 10(16) cm(-3) after neutron irradiation. Considering the device performance change, it indicates that the bulk traps within the Ga2O3 drift layer instead of interface states dominate the device degradation.

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