期刊
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
卷 23, 期 2, 页码 281-286出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2023.3269443
关键词
Organic photovoltaics; encapsulation; lifetime; adhesive
This study develops a low-cost UV adhesive as a sealant and the associated encapsulation architecture, highly improving the stability of organic photovoltaic (OPV) devices. The study demonstrates how the composition and additive in the UV adhesive as a sealant affect the OPV stability. The face sealing and UV adhesive enable the OPV device to successfully meet three industrial criteria of accelerated tests of OPV stability.
This study develops a low-cost UV adhesive as a sealant and the associated encapsulation architecture, highly improving the stability of organic photovoltaic (OPV) device. In detail, this present study demonstrates how the composition and additive in the UV adhesive as a sealant affect the OPV stability. The face sealing and UV adhesive enable the OPV device to successfully meet three industrial criteria of accelerated tests of OPV stability: (1) T-80 lifetime is more than 1000 h under the damp heat test of 65 degrees C/65% relative humidity (RH) environment, (2) T-80 lifetime is more than 1000 h under the damp heat test of 85 degrees C/85% RH environment, and (3) T-80 lifetime is larger than 1000 h under the continuous AM 1.5G solar illumination (i.e., light-soaking test).
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