A Rapid Matching Network Layout Synthesis and Optimization Method for High-Performance MMIC PAs Using Modified Implicit Space Mapping

Article Engineering, Electrical & Electronic

A 5.5/12.5-GHz concurrent dual-band power amplifier MMIC in 0.25 μm GaAs technology

Chunshuang Xie et al.

Summary: The concurrent 5.5/12.5-GHz dual-band power amplifier features a two-stage design with improved efficiency by lowering the drain voltage of the driver stage. It exhibits excellent performance in terms of high gain, large output power, and peak power-added efficiency at 5.5 and 12.5 GHz frequencies.

ELECTRONICS LETTERS (2022)

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Article Engineering, Electrical & Electronic

A 28-GHz Phased-Array Relay Transceiver for 5G Network Using Vector-Summing Backscatter With 24-GHz Wireless Power and LO Transfer

Michihiro Ide et al.

Summary: This article introduces a wirelessly powered phased-array transceiver for fifth-generation (5G) relay systems. By utilizing 24-GHz wireless power transfer (WPT), the relay transceiver operates without batteries. The proposed vector-summing backscatter is used for the transmitter, while a passive phase-shifting self-heterodyne receiver with a rectifier is employed for the receiver and WPT. The chip area of the transceiver is 1.8 mm² and it is mounted on a 32-element phased-array antenna board. The power consumption for each path is 0.03 mW in both transmitter and receiver modes.

IEEE JOURNAL OF SOLID-STATE CIRCUITS (2022)

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Article Engineering, Electrical & Electronic

A High-Efficiency 28 GHz/39 GHz Dual-Band Power Amplifier MMIC for 5G Communication

Heng Xie et al.

Summary: A high-efficiency 28 GHz/39 GHz concurrent dual-band power amplifier using the 90 nm GaAs pHEMT process is proposed for 5G communication applications. The amplifier achieves high efficiency by utilizing a low-loss dual-band output matching network and a large power push ratio.

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS (2021)

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Article Engineering, Electrical & Electronic

Analysis and Modeling of the Temperature-Dependent Nonlinearity of Intrinsic Capacitances in AlGaN/GaN HEMTs

Haorui Luo et al.

Summary: Modeling the temperature-dependent nonlinearity of intrinsic capacitances in AlGaN/GaN HEMTs can improve model accuracy, but current methods are inadequate for reflecting these variations accurately. By analyzing unmodeled phenomena and characterizing them based on device physics, this study shows that an improved intrinsic capacitance model enhances HEMT model accuracy at non-nominal temperatures.

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS (2021)

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Article Engineering, Electrical & Electronic

A 52-58 GHz Power Amplifier With 18.6-dBm Saturated Output Power for Space Applications

Yi-Fan Tsao et al.

Summary: This brief introduces a 52-58 GHz power amplifier with constant output power across the entire band. A new impedance transformation topology and stacked-FET power stage were adopted to reduce matching loss and enhance output power efficiency. The 2-stage PA demonstrated improved small-signal gain, saturated output power, and power-added efficiency at 54 GHz.

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS (2021)

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Proceedings Paper Engineering, Electrical & Electronic

A 2-18 GHz 13.5-W Distributed GaN HPA MMIC Based on Stacked and Tapering Techniques

Xu Yan et al.

Summary: This paper presents the design and analysis of a 2.0 to 18.0 GHz distributed high-power amplifier (DHPA) monolithic microwave integrated circuit (MMIC) on a 150-nm GaN-SiC HEMT process. The amplifier achieves ultra-wide bandwidth and good power performance through the use of an 8-cell 2-level-stacked architecture. It is fully integrated with non-uniform distribution, tapering drain-artificial transmission line (D-ATMLs), and inductive gain peaking structures to improve power added efficiency (PAE) and gain. Simulations show small-signal gain ranging from 18.5 to 16.0 dB, output power from 13.5 to 7.5 W, and PAE from 38.2 to 19.5% over a frequency band exceeding 16 GHz, with a compact die size of approximately 4.8 x 1.8 mm suitable for future broadband systems and applications.

2021 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM (IWS 2021) (2021)

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Proceedings Paper Engineering, Electrical & Electronic