A Design Method to Realize Manufacture-Friendly Millimeter-Wave Folded Substrate Integrated Waveguide Bandpass Filters

A design method for manufacture-friendly millimeter-wave (mm-Wave) folded substrate integrated waveguide (FSIW) bandpass filters (BPFs) is proposed in this brief. Based on conventional magnetic post-wall iris structure, etched parallel rectangular slots and an incompletely folded structure are introduced to serve as internal coupling structures. A design method is proposed to achieve lower fabrication errors and reduce the sensitivity to them by optimizing the coupling structures, thus, increasing the performance robustness. Then, an FSIW BPF based on the multilayer printed circuit board (PCB) is designed at Ka-band using the proposed method, and a conventional FSIW BPF is also designed as a reference. Both the two FSIW BPFs are fabricated, measured, and compared to confirm the effectiveness of the proposed method. The designed BPF using the proposed method exhibits a higher simulation-to-fabrication performance accuracy compared to the regular one, thus, should be a promising candidate for mm-wave applications.

Automated summary

This brief proposes a design method for manufacture-friendly millimeter-wave (mm-Wave) folded substrate integrated waveguide (FSIW) bandpass filters (BPFs). By introducing conventional magnetic post-wall iris structure, etched parallel rectangular slots, and an incompletely folded structure as internal coupling structures, a design method is proposed to achieve lower fabrication errors and reduce sensitivity to them. A designed FSIW BPF based on multilayer printed circuit board (PCB) using the proposed method demonstrates higher simulation-to-fabrication performance accuracy compared to a regular one, making it a promising candidate for mm-wave applications.