High-Tolerance Thin-Film Solder Joints for Electrical Interconnection in Harsh Environments

This article presents a pioneering use of thin-film solder joint in the electrical interconnection of high-temperature thin-film sensors (TFSs), which aims to improve the low tolerance of traditional soldered balls in extreme environments. The structure of the thin-film solder joint, composed of silver foil, solder joint paste, and metal wire, has a negligible mass compared to traditional soldered balls. As a result, the inertia force on the solder joint/substrate interface during vibration and force impact is greatly reduced, improving the reliability of the solder joint under thermal-mechanical coupling impacts. The thin-film solder joint has been verified using both metal (AgPd paste) and ceramic (TiB2/SiCNO paste) solders, and can withstand extreme environments such as thermal shock and high g loading. The designed thin-film solder joint can withstand impact energy of up to 3 J at 1000 degrees C without failure, which is six times higher than that of traditional soldered balls (with a statistical failure rate of up to 67% under 0.5 J impact). The thin-film solder joint was successfully used for electrical interconnection of high-temperature thin-film strain gauges (TFSGs), demonstrating excellent reliability under thermal-mechanical coupling impacts at 1000 degrees C. Our high-tolerance thin-film solder joints show promising potential for use in electrical interconnection in harsh environments.

Automated summary

This article presents a novel use of thin-film solder joint in high-temperature thin-film sensor (TFS) electrical interconnection, aiming to improve the low tolerance of traditional soldered balls in extreme environments. The structure of the thin-film solder joint, composed of silver foil, solder joint paste, and metal wire, reduces the inertia force on the solder joint/substrate interface, enhancing reliability under thermal-mechanical coupling impacts. The thin-film solder joint demonstrates excellent performance in extreme environments and shows promising potential for electrical interconnection in harsh conditions.