4.6 Article

Enhanced corrosion inhibition of copper in acidic environment by cathodic control of interface formation with 2-mercaptobenzothiazole

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ELECTROCHIMICA ACTA
卷 447, 期 -, 页码 -

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PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.electacta.2023.142162

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Corrosion inhibition; Copper; Cyclic voltammetry; XPS; ToF-SIMS

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In this study, electrochemistry and advanced surface analyzes were used to investigate the inhibition of copper corrosion by 2-mercapto-benzothiazole (2-MBT) in hydrochloric aqueous solution and the influence of electrochemical control on the formation of the inhibiting interface. The results showed that reduction of the native surface oxide prior to exposure to the inhibitor significantly decreased the rate of anodic dissolution. Increasing the exposure time to the inhibitor enhanced the protection against dissolution. 2-MBT adsorbed as multilayers and bonded to both metallic copper and residual copper oxide islands through its sulphur atoms. Partial dissociation of the molecule released exocyclic sulphur, which bonded to metallic Cu. Further dissociation released endocyclic sulphur, induced by anodic polarization, causing defects in the organic layer and compromising its barrier properties.
Electrochemistry along with advanced surface analyzes (X-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry) were implemented to investigate copper corrosion inhibition by 2-mercapto-benzothiazole (2-MBT) in hydrochloric aqueous solution and the effects of electrochemical control on the for-mation of the inhibiting interface. It is shown that reducing the native surface oxide by cathodic reduction prior to exposure to the inhibitor drastically decreases the rate of anodic dissolution. Additionally, increasing the exposure time of the metal surface to the inhibitor results in even better protection against dissolution. 2-MBT adsorbs as multilayers and bonds to both metallic copper and residual copper oxide islands via its sulphur atoms. Partial dissociation of the molecule, releasing the exocyclic sulphur, which then bonds to metallic Cu, is observed. Further dissociation of the molecule, releasing the endocyclic sulphur, is induced by anodic polari-zation, forming defects in the organic layer and thus compromising the barrier properties of the organic layer.

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