Modification copper surface by micron thickness film via thiol-based click reaction

Films with micron thickness were fabricated on copper via thiol-based click reaction between dithiol and epoxy group or vinyl ester group on silane without metal catalyst or light irradiation. The protection efficiencies were 99.6% and 99.4% for the epoxy silane and vinyl ester-silane participated click-assembly film, respectively. The driving force for film formation was the strong interaction between thiol and copper and then new C-S bond formation via thiol-ene or thiol-epoxy reaction. Molecular dynamics simulation further revealed the most stable adsorption configurations and the adsorption energy of the building blocks on copper substrate to provide theoretical support for experimental conclusion.

Automated summary

Films with micron thickness were prepared on copper through thiol-based click reaction without metal catalyst or light irradiation. The protection efficiencies of the epoxy silane and vinyl ester-silane participated click-assembly films were 99.6% and 99.4%, respectively. The film formation was driven by the strong interaction between thiol and copper, leading to the formation of new C-S bonds via thiol-ene or thiol-epoxy reaction. Molecular dynamics simulation provided theoretical support for the experimental conclusion by revealing the most stable adsorption configurations and adsorption energy of the building blocks on the copper substrate.