High-efficiency electromagnetic interference shielding and thermal management of high-graphene nanoplate-loaded composites enabled by polymer-infiltrated technique

Polymer composites embedded with high filler loads (>= 50 wt%) are urgently needed to address the electro-magnetic interference (EMI) shielding and thermal barrier problems for the high-power integrated electronic devices. However, designing polymer composites with high filler loads remains a challenge due to difficulties in processability and poor flexibility. Herein, high graphene nanoplates-loaded polyurethane (GNP/PU) composites were enabled by a tractable and scalable polymer-infiltrated technique, in which GNPs were in compact contact face to face and arranged along the in-plane direction. The formation of such structure provided good channels for the transmission of electrons and phonons in the GNP/PU composites. Impressively, the GNP/PU composites showed strong EMI shielding and thermal conductivity, with a superior EMI shielding effectiveness of 67.6 dB (0.4 mm thickness), and extremely high thermal conductivity of 41.60 W/(m.K). Moreover, the GNP/PU com-posites were proven to have excellent mechanical flexibility, EMI shielding stability, and thermal management capability. With good comprehensive performance and high processability, the GNP/PU composites hold great promise for EMI shielding and thermal management applications in the field of highly integrated electronics.

Automated summary

High graphene nanoplates-loaded polyurethane (GNP/PU) composites were successfully developed for electromagnetic interference (EMI) shielding and thermal management applications in the field of highly integrated electronics. The composites demonstrated strong EMI shielding effectiveness and high thermal conductivity, with good mechanical flexibility and stability. The formation of compact contact between graphene nanoplates provided excellent channels for electron and phonon transmission.